DS1000
Semiconductor slicing machine
DS1000 is a wire-cut electrical discharge machine that efficiently slices wafers from ingots made of the next-generation semiconductor material SiC. 0.1-mm wires are precisely positioned, enabling simultaneous slicing of an ingot into 40 identical wafers. While conventional grinding with an abrasive-coated wire saw has problems with processing time and cutting margin width, electrical discharge slicing is heat-free, enabling faster slicing with narrower margins. Faster cutting speed reduces the cost of next-generation materials.
Client / Manufacturer
Design
Mitsubishi Electric Corporation
Tokyo, JPMitsubishi Electric Corporation Integrated Design Center
Kamakura, JPDate of Launch
2019
Development Time
13 - 24 months
Target Regions
Asia, Europe, North America
Target Groups
Trade / Industry