AX07
Semiconductor Manufacturing Equipment
This product is a semiconductor manufacturing equipment that "films/laminates" metal and insulators that serve as electrical circuits at nano levels of thickness. This is a next-generation film deposition platform that realizes modularization for a wide variety of material film deposition for rapidly diversifying semiconductors. The complex internal mechanism is covered in the shape of a polygonal pole to drastically improve miniaturization, expandability and operability. It increases the safety and security of operators working in clean rooms and their motivation to work.
iF Gold Statement
This highly complex machine, designed for cleanroom manufacturing of semiconductors, maximizes efficiency by modularizing production. It dispenses with the need for separate development and production equipment by combining the capabilities for both phases in a single, compact machine. This concise design also reduces power and water consumption considerably. We were particularly impressed by the playful geometry of this design.
Client / Manufacturer
Design
CANON ANELVA CORPORATION
Kanagawa, JPCanon Inc.
Tokyo, JPYasunori Senshiki (PD) / Nobuo Oshimoto, Emiko Yoshio, Tatsuya Hisatomi (UI) / Susumu Oya, Masatoshi Lin, Akari Komma (UD)Date of Launch
2024
Development Time
Confidential
Target Regions
Asia, Europe, North America
Target Groups
Trade / Industry